Hey! get some CPU news up here. A couple of days ago, Gamers nexus revealed some of the leaks they received for AMD’s upcoming AM5 platform. He showed them to us to draw a comparison to other leaks currently circulating about the AM5 socket and its configuration. Specifically, the amount of pci-e lanes on the CPU which is different between the current information and what he received about a year ago.
Now that’s fine, AMD might have changed something, in fact Steve thinks the current information is more likely accurate. But then he showed this little guy. A block diagram of AMD’s CPU layout for Raphael, aka the next step in the Zen architecture.
Now as we kind of have come to accept, it looks like Ryzen 7000 or whatever mainstream name AMD gives to the Zen 4 architecture, Ryzen 7000 will have a max of 16 core and 32 threads. The dies / CCD’s are still 8 cores and we don't see a third die here. We can see the codename which was Durango, but what actually got my interest is this right here. The IO die.
So for the Core chiplets, AMD evolved their process from 7nm to 7nm+, as for the IO die, AMD stuck with a larger 12nm process. Well, it looks like for zen 4, its going to go down to a 7nm + process. How can I say that?
Well, the IO Die seems to have been planned to house the integrated graphics! Also, if this releases in 2022, It would make sense for it to have RDNA 2 graphics which also are on 7nm+. This could also mean that every single Ryzen model from AMD could have integrated graphics!