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Event Report: GIGABYTE Open Overclocking Championship 2009

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Associate Review Editor
Nov 8, 2006

Event Report: GIGABYTE Open Overclocking Championship 2009

Last week, on June 3rd, GIGABYTE hosted the final worldwide event of the GIGABYTE Open Overclocking Championship 2009 competition. After countless country qualifiers and four regional finals, this event would be the climax, bringing together many of the world's very best overclockers for a one-day showdown event. The final was once again held in Taipei, Taiwan but this time during the Computex 2009 exhibition week, which definitely added another layer of excitement to the proceedings since most of the industry and media heavyweights were in town.

As with the very first GO OC final event last year, Hardware Canucks was on hand to report and bring you an in-depth look at the competition like no one else can. So grab a drink, sit back, and see what it is like to compete in a world-class, high stakes overclocking competition.

Ready? Let's get started!

GO OC 2009 differed from last year's event most notably by its more aggressive country and regional competition, which assured that only the very best from each region would make it to the final event. Now obviously there were no undeserving competitors last year, but the sheer number of competitors (46!) was obviously a logistical nightmare. As a result, this year's competition was paired down to 12 individuals, forming 6 teams.


Team USA 1, comprised of Fugger and Vapor, got a free pass to this event because they were the winners of the Freestyle Contest last year. Likewise, Elmor & SF3D of Team Sweden were invited because they won the Best P45 OC Contest. Those of you who are members of any enthusiast forums, such as XtremeSystems or OC Forums, should already be familiar with many of these usernames. As you can see, there are quite a few competitors who made it to this event who competed in last year's final, which shows tremendous talent and preparation on their behalf. Every single attendee proved themselves by beating the best overclockers from their respective regions, but how would they fare against global competition?

Here some gratuitous glamour shots of each team:

Team Sweden is M.I.A simply because they kept delaying their photo shoot, and I'm not entirely sure if/when they finally got their pictures taken. Don't worry though, you will catch quite a few glimpses of them in the coming pages...
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Associate Review Editor
Nov 8, 2006
Schedule / Guidelines

Schedule / Guidelines


Fixing a flaw from last year's competition, all competitors were flown in a full 2 days before the actual start of the event, and were therefore able to recover from jet lag. There was also a full day dedicated solely to preparation, which I know was absolutely appreciated by everyone in attendance.


As you can see, competitors were given a full 4.5 hours of prep time on June 2nd, and you will see they used every second of it! On the actual competition day, GIGABYTE slotted in some extra preparation time between each benchmark which was also tremendously useful and frankly an absolute necessity in order to achieve top-level results with the provided hardware.


Competition I & II: Battle for the Best X58 OC

For the first part of the competition, Gigabyte provided the following hardware configuration:

Aside from the engineering sample processors, the rest of the components were products that you can easily find at your favorite online retailer. Windows XP SP3 and Windows 7 Release Candidate (RC) was preloaded on two separate SSDs, along with the GeForce 181.22 graphics driver and all the necessary benchmarking programs and tweaking tools. Here is the full list of preloaded software:


It should be noted that a decision was made among the competitors to run with PhysX disabled , in order to allow CPU performance to play a greater role in the 3DMark Vantage results. Also, the BIOS used was a newer (likely beta) F7D version.

The rules for this first competition were quite simple:
  1. Competitors were not permitted to use their own hardware or software.
  2. GIGABYTE will provide hardware replacement if the original one dies or fails.
  3. Competitors had to bring their own LN2 pots, soldering irons, hardware modification components, insulation material, multi-meters, digital thermometers, hair dryers, etc.
  4. Competitors had to save their scores and screenshots on a Gigabyte-provided USB thumb drive, no others were allowed on-site.

  • Score Submission
</u>Points were awarded based on the results of each benchmarking round. The Top 5 teams in both of the benching rounds would be awarded points. The competitors had to do a printscreen, save the results on their USB thumb drive, and raise their hand to submit a score. Gigabyte judges would then verify and add the score to the live database. Naturally, the team with the highest point total at the end of the two rounds would be declared the winner. In case of a tie, the team with the highest Super PI 32M would be declared the winner.


  • Prizes
In a competition of this magnitude, the winners' bragging rights would almost be enough, but Gigabyte sweetened the deal with some sizable cash prizes:​

  • 1st Place: US$ 5,000 cash and sponsor products (Total US$ 6,000 prize value).
  • 2nd ~ 6th Place: Sponsor products (Total US$ 1,000 prize value).
Simple enough? Well then let us move on to the Preparation Day...
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Associate Review Editor
Nov 8, 2006
Preparation Day

Preparation Day

As mentioned in the introduction, the Gigabyte Open Overclocking Championship 2009 was held in Taipei, but while last year the event was held across from Taipei 101, this year's event was held inside the towering 509.2 m / 1,670.60 ft skyscrapper.

It was somewhat fitting to see a Formula 1 car and world-class overclockers in the same area, since they are both focused on optimal performance at the razor's edge of stability and reliability. Too cliché, I know...

GIGABYTE had reserved an entire floor in Taipei 101, which largely served as a launching pad for the company's Computex 2009 festivities. For the preparation day, a boardroom was prepared for the competitors with plastic on the floors to protect the carpets from liquid nitrogen (LN2) cold burns...if there is such a thing. Although we were 'only' 35 floors up, the view was extremely impressive despite the cloudy conditions.


GIGABYTE once again stepped up to the plate when it comes to LN2, with more than enough on hand to supply the 6 teams during both days of preparation and competion.

The stars of the day, and the topic of discussion that was most prevalent during the days ahead of the preparation day, were the brand new engineering sample Intel Core i7 975 Extreme Edition 3.33Ghz processors. Were they highly binned cherry chips? Were they just regular E.S samples? Everyone was anxious to get their hands on the chips, and once the 30 CPUs were brought out everyone swarmed around them. Unlike last year's event, where Hicookie pre-tested all the processors to ensure a level playing field, this year the teams would receive 5 chips each and could do their own binning. Everyone agreed that this was a fantastic idea, and should absolutely be the norm from now on at all large-scale overclocking competitions.


The motherboard of choice for this event was the GIGABYTE GA-EX58-UD5, which we had the opportunity to review, and which is a very stable model with aggressive performance characteristics.


On the graphics card front, each team received two Gigabyte GeForce GTX 260 216SP cards to run in SLI configuration. Although more powerful GTX 285 or GTX 295 cards could have been used, the chosen GTX 260's were a good choice simply because every competitor was very familiar with them and the SLI world record was easily within reach. The Enermax Revolution 85+ 1050W unit served as the power plant for these highly overclocked system, and frankly it's one of the very best 1000W+ power supplies on the market (expect a review soon).


The competitors were supplied with Kingston HyperX PC3-16000 3GB triple-channel memory kits, which to the best of our knowledge is manufactured with Samsung's highly regarded HCF0 ICs. There is no denying that the competitors were a little disappointed with this kit, since everyone logically would have preferred memory featuring the record-breaking Elpida Hyper memory chips. Would this kit be a bottleneck? We'll find out shortly.

Each team was given two Intel X25-M 80GB SSDs, one with Windows XP SP3 pre-installed for the SuperPI 32M round and one with Windows 7 RC pre-installed for the 3DMark Vantage round.


Having received all their components, the competitors started to unpack the 'tools of the trade' that they brought from home and nearly everyone had K|ngp|n's F1 and Tek-9 copper LN2 pots. As long as Kingpin keeps manufacturing mounting brackets for these pots, they will continue to be used (and dominate) on all upcoming platforms and graphics cards.


It really did not take long for teams to start ripping apart their hardware. Here we see x800pro applying nail polish to one of the GTX 260's, in order to help seal the small electrical components from condensation, while his partner Lok begins insulating the motherboard.


Here Deanzo of Team Australia is soldering voltage read points to be able to measure the motherboard's actual vCore.

Elmor of Team Sweden is verifying the motherboard's resistance prior to starting the voltage modification, while his partner SF3D removes the plastic shroud from the GTX 260.

Likewise, Sno.lcn of Team USA 2 is removing the plastic shroud and stock cooler to expose the impressively large heatspreader of the NVIDIA GT200 core. You may notice that the core is labeled G200-103-A2, which means that it is a 65nm part. The newer cores manufactured on the 55nm process are labeled G200-103-B2.

Miahallen, also of Team USA 2, is applying kneaded rubber to the motherboard, which will serve as the primary means of insulation. Kneaded rubber was really only introduced to the overclocking community last year, and since then it has arguably become the de facto means of insulating for LN2 sessions, effectively replacing the foam + Vaseline combo that was overwhelmingly used for years and years. Once you get used to applying it there is simply no going back to previous methods, since kneaded rubber comes off quickly and leaves no mess on the motherboard.

Here we see Vapor of Team USA 1 affixing thermal probes to both GPU pots and the F1. There's really no need to repeat that accurate temperature measurements are a must when overclocking with LN2, especially when dealing with components with cold bugs.

One of the fantastic new features of the Core i7 platform is the ability to easily remove the retention module with a 3mm allen wrench. What this does is give sub-zero overclockers a much larger and cleaner area to work with when insulating the motherboard and the socket itself, and I was actually surprised that many teams actually did not take advantage of this quick & easy trick.

After removing the socket, here we see Fugger applying kneaded rubber to the motherboard. As you can see, it does a great job at isolating the processor and it can be worked to conform to the base of any LN2 pot.


Here x800pro uses tape to form another insulating layer on the graphics cards, while Lok installs the motherboard onto his trademark benching platform.


Continuing their work on the UD5, Team Sweden's SF3D checks the resistance prior to starting a voltage modification, while Sno.lcn prepares the wiring for his GPU modifications.

Here we see pt1t from Team Belgium cutting and installing insulation foam for the motherboard, which as you can clearly see is a much more labour intensive process than with kneaded rubber method.


Miahallen of Team USA 2 puts the finishing touches of his motherboard insulation job, which closely mirrors Team USA 1's method.


Due to a shortage of 110V electrical outlets, Sno.lcn of Team USA 2 was forced to improvise and valiantly sat on the floor in that corner for more than an hour while doing all the necessary soldering for the GPU modifications.


Here we see Dinos22 of Team Australia loosening the plastic push-pins in order to remove the motherboard's cooling system, there is really not much love for stock coolers among this group.


While Elmor begins soldering a GTX 260, Deanzo applies a sealing coat of nail polish to the area around the CPU socket.

Team China was lightning quick in every respect, not only did they have their first graphics card insulated and modded way before anyone else, but they were the first to start getting the LN2 flowing as well.


Due to the highly secretive nature of the Volterra VT1165 multi-phase voltage regulator that is found on GTX 260 216SP 65nm cards, a discussion broke out regarding what teams if any had the overcurrent protection (OCP) modification. It was subsequently decided that since one or two teams knew the mod that it would be shared (by Dinos22) with everyone, since it could provide the knowledgeable teams with a significant advantage. With this in mind, Hicookie wisely chose to give every team a third GTX 260 just in case they damaged one of the other two while attempting this new modification.

The second team to have their system LN2-ready was Team USA 1, and here we see Fugger filling up a thermos. From what I recall the first boot attempt was not a success, but removing and switching around the memory modules fixed the issue quickly.


Here we see Dinos22 who was having way too much fun applying vaseline to the motherboard, while Deanzo begins modifications on one of the GeForce cards.
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Associate Review Editor
Nov 8, 2006
Preparation Day Continued

Preparation Day Continued

Here we see Team USA 1's graphics cards after being sprayed with Plastik 70 conformal coating, which is an acrylic resin that has fantastic insulating properties. The downside is that it emits some vicious vapors, but in a very humid environment like Taiwan it is really a must-use on all PCB surfaces.


Here we see Team USA 2 trying to troubleshoot their non-booting system. A tear down would later reveal that their motherboard was faulty.

Given Team USA 2's problems, Team Belgium was the third team to have a booting system. In the mean time, Elmor and SF3D were still in the process of modifying and preparing their hardware.


Team Australia had a great pre-cut self-adhesive piece of insulation that covered the whole back of the motherboard.


By the three-hour mark all the team's had a functioning system, and they were all focusing exclusively on SuperPI in order to stress test their 5 CPUs.


Slowly but surely, it became clear that this particular processor batch averaged in the 5.3Ghz range, give or take.


Being able to save profiles in the UD5's BIOS was a huge time-saver, and it was used by the all the teams.


This is a good action shot as just when Miahallen looked away, the system BSOD'ed.

When you've got a nearly unlimited supply of liquid nitrogen at your disposal, chilling beer is a matter of 1-2-3 as demonstrated by miahallen.


Team Australia seemed to have a good processor capable of around 5.44Ghz, but...


...Team Belgium had an even better 5.6Ghz chip, and just for the heck of it they tried to boot at 6Ghz! It booted briefly, but crashed milliseconds after this picture was taken.


Team Australia's main issue was that for some reason hyper-threading would not disable, no matter what was selected in the BIOS. With Hyper-threading enabled, processors run a good deal hotter, and HT is useless for single-threaded apps like SuperPI, so disabling it was a priority.

Despite their initial motherboard issues, Team USA 2 were binning their processors at an impressive rate, and they actually managed to test 4 of them on prep day.


Here have Trouffman of Overclocking-TV (responsible for the live feeds everyone enjoys so much) swimming in Deanzo's LN2 mist, along with special guest RDRASH who competed in the North American regional finals and was also present during GO OC 2008.

Team Belgium's Dragon F1 frosting over.


In order to 3D bench their processors, Team Sweden used 3DMark06 instead of 3DMark Vantage since it doesn't take as long to run. For his part, Team China's x800pro is so hardcore that he LN2 cools components that aren't even plugged into a system!


Once Team Australia reflashed the BIOS, the hyper-threading issue disappeared, and they were finally able to properly bench and tweak their system.


Most of the teams were so busy binning CPUs and running SuperPI that they didn't even have a chance to ensure that their graphics cards were functional, much less good overclockers.


As the preparation day came to a close, it was time for all the teams to disassemble and dry their systems.


There was a couple of dead and/or moist components here & there, but the overall damage for the day was minimal. Would the competitors be as hardware-friendly tomorrow? Doubtful.


It was interesting/funny to see $1000 'rejects' lying around everywhere. Team USA 1 lapped their best processor, which is something that all teams were allowed to do, but few were equipped to do.

Once their systems were torn down and dried, each team was given a box to place their components into, and then the preparation day was over.
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Associate Review Editor
Nov 8, 2006
Competition Day - Walk-In & Warm-Up

Competition Day - Walk-In & Warm-Up


On June 3rd, competition day, GIGABYTE pulled out all the stops and the competitors were greeted with a sweet GO OC ice sculpture.


All the competitors lined up to sign their names on the wall.

Leading into the competition room, there walls were lined with a recap of all the country qualifiers and regional finals that led to this worldwide final event.


While all the competitors would receive the batch of sponsor products, only the winner would get the Champion's trophy and the $5000 USD cheque.

On display, GIGABYTE had the new GA-EX58A-EXTREME and GA-EX58A-UD4 motherboards, which were later joined by a GA-EX58A-UD4P. We can expect this new X58 line-up to hit the retail channel within a month or so.


Even more special was the Lynnfield demo system that they had running off of one of their upcoming P55 motherboards. Regrettably, no interaction with the system was permitted.

The flags were out for competition day, teams could compete for national pride!


Here was the schedule for the day, and as you can see, there was only 46 minutes left in the warm-up/set-up session before the start of SuperPI 32M competition.
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Associate Review Editor
Nov 8, 2006
Competition Day - Warm-Up & Opening Ceremony

Competition Day - Warm-Up & Opening Ceremony

With the timer ticking, the team's now had to unpack their boxes, rebuild their systems, and test whatever components they had not had the chance to test the day before.

The team's generally took their time with the rebuild, taking extra care to ensure that their insulation was well done as possible to prevent any catastrophic, time wasting hardware failures. However, as you will see, whatever can go wrong usually does at these competitions.

For the competition day, GIGABYTE had professional whose sole task was filling thermos and resupplying everyone with liquid nitrogen. He proved quite popular with the public and invited guests, most of whom had obviously never seen liquid nitrogen being used in person.


Team Sweden and Team USA 2 were rocking the puppets for good luck.


Team USA 1 and Team China both had not tested their modified graphics cards during the preparation day, so that was priority #1 for both teams.

Team Australia had 4 CPUs left to test, so they had a fairly significant work load ahead of them.


Sno.lcn of Team USA 2 was focused on putting the finishing touches on the team's GeForce GTX 260's.

Luckily for Team USA 1 both graphics cards worked perfectly, so that was one huge potential hurdle avoided.


Likewise, Team China's cards were fully functional, so Lok put the finishing touches on the cards.


All the teams had rebuilt their systems, and everyone appeared to have fully functional systems...for now.


While teams kept testing their CPUs, it was generally accepted that no one would catch up to Team Belgium's 5.6Ghz monster.


With the warm-up session winding down, and media packing into the room, it was time for the MC Colin Brix to start with the introductions.

First things first, all the sponsors gave a brief speech...


...and then they smashed the SuperPI/3DMark ice sculpture into a million bits.


Next all the competitors were called on stage, but with time running out and the sub-zero cooled systems sitting unattended, they were all anxious to get back to the business at hand.


Now it's becoming tradition that an overclocking competition needs cold beer on hand, so hicookie took it upon himself to insta-cool a few cans.

With that done, it was time for the SuperPI 32M competition to begin!
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Associate Review Editor
Nov 8, 2006
Battle for the Best X58 OC: SuperPI 32M

Battle for the Best X58 OC: SuperPI 32M

The first event of the day was SuperPI 32M, which is one of the most popular and competitive benchmarks in the enthusiast realm...right after SuperPI 1M. Latency, memory, and Uncore speeds are important in SuperPI, but processing power is the most crucial factor, so whoever could clock their Intel Core i7 975 XE the highest had a good chance of winning. Given the length of time is takes to run the benchmark, stability is very important as well and software tweaks can play a very significant role in maximizing overall efficiency, which is why SPi 32M is a fairly difficult benchmark to master.


The competition has begun, 100 minutes of SuperPI action.


Team USA 1 was first on the board, setting the bar at a respectable 6 minutes 56 seconds. Being first on the board is a psychological victory more than anything else and is often run with less than optimal settings, so there was no doubt the result would be beaten quickly.


By the 20 minute mark, 5 out of 6 teams had results on the board. Team USA 2 had not posted a result yet because they were having motherboard issues and decided to swap for another sample.

After their first successful SuperPI run, Team Australia killed both their motherboard and their best CPU, so they had to tear apart the whole system once again.

Team USA 1 were throwing results on the board fast and hard, but given their 200Mhz processing deficit to Team Belgium, catching up would be a near miracle.


Team Sweden flew under the radar for a bit, but they posted an impressive and very efficient result.


Despite leading the way for most of the competition, Team Belgium did not rest on their laurels, and with their mighty processor they posted a truly awesome 6 minute 40 second result.

Team USA 2 managed to get their system up and running well enough to be able to throw a quick result up on the board, which was actually an impressive achievement given their hardware problems.


Although Team Australia had their new system up quickly, given their unfamiliarity with the new CPU and the 'green' motherboard they were not able to surpass their initial result.


Having posted a result, if only for symbolic reasons, Team USA 2 started preparing their system for the 3DMark Vantage competition.


Satisfied with their SuperPI result, Fugger and Vapor also begin immediately prepping for 3DMark Vantage, which they were evidently very well prepared for.

The final results for the SuperPI 32M competition were:


Submitted Scores:

Here are the submitted screenshots of the top scores for each team, which should provide a clearer picture of the system clocks and timings each team was running to achieve their best results:

Team USA 1

Team USA 2

Team Australia

Team Belgium

Team China

Team Sweden

Next up is 3DMark Vantage!
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Associate Review Editor
Nov 8, 2006
Battle for the Best X58 OC: 3DMark Vantage

Battle for the Best X58 OC: 3DMark Vantage

With the SuperPI 32M competition over, the competitors had 1 hour to prep for the 3DMark Vantage round.


As mentioned in the guidelines section, although the rules originally stated the 3DMark Vantage would be run with PhysX acceleration enabled, the competitors had a vote and decided to run the benchmark with it disabled. With PhysX enabled, the CPU is effectively taken out of the equation and the overall score difference between a 3.2Ghz and 4.2Ghz Core i7 processor can be as small as 100 points. Therefore, those with more powerful processors would have now have a slightly greater advantage.


Having started to disassemble their system near the end of the SuperPI round, Team USA 1 was still in the process of drying their board and prepping their graphics cards for the round ahead. They appeared confident enough in their hardware and strategy that they did not need the whole hour to prep for 3DMark Vantage.

Team USA 2 had started to prep for the 3DMark Vantage round during the SuperPI round, and they had their system up & running quickly.


Team China was powered up and ready to go as well, and they appeared to have a very strong overall setup.


The Australian Team seemed to have fixed all issues, and were also looking to be top contenders for the 3DMark Vantage round, especially given Deanzo's expertise at overclocking GTX 260's.

Here sno.lcn of Team USA 2 is preparing the third graphics card, which was a wise choice since they were pushing their cards hard enough to create massive artifacts.


Nearing the end of the preparation time all the teams had functional systems, and they all seemed dialed in and ready to perform.


With the 3DMark Vantage prep time over, it was onto the actual competition.
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Associate Review Editor
Nov 8, 2006
Battle for the Best X58 OC: 3DMark Vantage Continued

Battle for the Best X58 OC: 3DMark Vantage Continued

In the 3DMark Vantage round, the teams that had performed subpar in SuperPI had a chance to win it all since up to 16 points were up for grabs to the team who posted both the highest graphics and overall scores. As you all know, 3DMark Vantage is a heavily GPU-dependent benchmark so although CPU power would come into play, it was tweaks and GPU clocks that would likely pave the road to victory.


The 3DMark Vantage round has begun, this is make it or break it time, and yet Team USA 1 looked very laid back.


Impressively, Team Australia were the first on the board and with a very respectable score as well.

After running some quick 3DMark06 tests for stability, Elmor takes the helm for the 3DMark benching session. Team Sweden is third on the board, but with a fairly weak result.


Team USA 2 were still pushing their cards to the brink, as evidenced by both memory and GPU artifacts on the screen.


Team USA 1 were fourth on the board, but with a weak result. Were they perhaps just toying with the other competitors?

Surprisingly, Team USA 2's motherboard bites the dust before the graphics cards do. Not only has a small puddle of water formed around the chipset cooler, but they have also managed to break off a part of the third PCI-E x16 slot. Time for motherboard #5 for miahallen and sno.lcn.

Out of nowhere, Team USA 1 achieved a massive result, surpassing the other competitors by over 1000 points.


Team Belgium posted their first score, and although it was the weakest so far, it's clear that they were just trying to get a result on the board.


With a little additional GPU voltage at the hands of Elmor, Team Sweden bolstered their score by almost 1100 points.


Less than 10 minutes later, Team Sweden increased their score by another 700 points and overtook Team China.

Not one's to sit on their hands, Team China quickly reclaimed their position #3 with a score of 27972.


Sno.lcn is seen here getting ready to blow dry one of the graphics card's prior to installing it in the team's latest motherboard.

With a flaky system, the Aussie/Kiwi combo could do nothing but smile as they were passed by the surging Team China.


Miahallen and Sno.lcn worked as a team to get their system back up and running as fast as possible in the hopes of getting a score on the board in the dying minutes of the competition. Regrettably, there just was not enough time left.


Having executed their plan perfectly, and with the help of a clever 'old school tweak', Team USA 1 crushed the competition in both graphics and overall scores.

The final results for the 3DMark Vantage competition were:


Submitted Scores:

Here are the submitted screenshots of the top scores for each team, which should provide a clearer picture of the system clocks and timings each team was running to achieve their best results:

Click on images to enlarge

Team USA 1

Team USA 2
No Score

Team Australia

Team Belgium

Team China

Team Sweden

With the end of the 3DMark Vantage round, the competition is over, so let's find out who walked away the winner.
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Associate Review Editor
Nov 8, 2006


With both the SuperPI and 3DMark have been completed, it was time to announce the winner of the GIGABYTE Open Overclocking Championship 2009.


However, before that announcement, GIGABYTE had a lucky draw for one of their brand new Booktop M1022 netbook's. The first two people who's names were picked were not in attendance, and as luck would have it, the third name picked was that of RDRASH, the most loyal GO OC fan and North American regional final's competitor.


All the teams were then called on the stage for a quick photo-op, and then it was time to reveal the overall winner...


As you can see, Fugger and Vapor of Team USA 1 were the winners of the GIGABYTE Open Overclocking Championship 2009, an impressive follow-up to their Freestyle Competition win at GO OC 2008.


Not only did they get the coveted trophy, but they got the even more coveted $5000 USD cash prize...and the right to gloat until next year's GO OC competition.


Another GO OC tradition is to LN2-cool the winner's tropy and that opportunity was certainly not overlooked. Congrats once again to Fugger & Vapor for winning this event in a decisive manner, the preparation that they put into this competition was evident and it clearly paid off.

Last year's GO OC event was the first of its kind, both in terms of the global nature of the competition and by its unanimous success. While many were worried that it would be a one-time event, GO OC 2009 have put those fears to rest. Although the final event may have been smaller than before, the countless country qualifiers and the impressive regional finals ensured that the best overclocking talent from every possible region had a chance to compete and demonstrate their abilities. Clearly, GIGABYTE have created an event that the enthusiast community wants, and no one have yet come close to matching GIGABYTE's execution and success with this type of overclocking-focused competition. Hopefully the company continues to see the value in hosting these types of events, as they are a catalyst to furthering the GIGABYTE brand as a top-choice for enthusiast users.

We hope to do it again next year!

Special thanks go out to Rita, Eileen, Angela, Sherri, and all the GIGABYTE staff for their hospitality and once again allowing Hardware Canucks to cover this phenomenal, one-of-a-kind event!

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