Personally, I think the biggest concern for motherboard components should be straight up airflow as opposed to actual temps (within reason of course). Most motherboard components have pretty high operating ranges so my main worry is that there aren't any dead air spots in the case.
Well I don't know about Dan's case, but in mine the entire rear of the case is grilled, and the X570 mobo has its own fan for the NB that also helps cool the vrms near the IO panel via a heatpipe. Only the upper edge VRMs are alone, and even they use a TALL passive heatsink. I think as long as a single fan H80 can get the airflow moving past it all and out (with the help of a case fan) then I think I'm set. But I will be testing it all to be certain.