CMetaphor
Quadfather
Odd question I just asked myself.
Background: I've got an external Nvme in a usb 3.1 aluminum enclosure. It's essentially a small ALU heatsink.
I use it in two positions on my desk:
1) Sitting completely by itself. Aka allowed to cool solely through passive radiation of heat.
2) I put it in the direct path of an exhaust fan. Which obviously has far greater airflow *but* the air is far hotter.
Now for a while I've assumed that #2 is better, but I'm not certain on it.
Sufficed to say, I need to ask someone with knowledge of thermodynamics and physics.
There must be a way to determine at what point one method is superior or inferior to the other. Ex: with a far greater heatsink crossection the enclosures heatsink might perform far better passively and possibly Worse in the exhaust of the PC, since more of the heatsink could soak in the heat of said exhaust.
Any takers? Maybe I should just keep these thoughts in my head...
Background: I've got an external Nvme in a usb 3.1 aluminum enclosure. It's essentially a small ALU heatsink.
I use it in two positions on my desk:
1) Sitting completely by itself. Aka allowed to cool solely through passive radiation of heat.
2) I put it in the direct path of an exhaust fan. Which obviously has far greater airflow *but* the air is far hotter.
Now for a while I've assumed that #2 is better, but I'm not certain on it.
Sufficed to say, I need to ask someone with knowledge of thermodynamics and physics.
There must be a way to determine at what point one method is superior or inferior to the other. Ex: with a far greater heatsink crossection the enclosures heatsink might perform far better passively and possibly Worse in the exhaust of the PC, since more of the heatsink could soak in the heat of said exhaust.
Any takers? Maybe I should just keep these thoughts in my head...