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Work in progress Project "I'm sick of shoehorning things in a Cerberus-X and I'm moving to a MORA3 rebuild".

Xeven

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Aug 20, 2010
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Vancouver, BC
The board has some warping. Usually doesn't matter, but we'll see. 😬
YiwJFKU.jpg
 

sswilson

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I honestly don't think I'd accept that (especially on a stupidly expensive board). Yes it will flatten out once it's installed on the case, but (IMO) that warping indicates that some of the component pins and/or the board heatsinks aren't evenly installed/soldered.

I'd be concerned that once you tighten it down in the case, the solder traces that aren't resting naturally in the "flattened" state will develop cold joints and/or outright separate from the board over time.

Not sure if I explained that well, but needless to say it's not an ideal situation.
 

Bond007

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The board has some warping. Usually doesn't matter, but we'll see. 😬
YiwJFKU.jpg

Jesus. That's a potatoe chip!

Wow. Not expected on that expensive a board... or maybe ever! Perhaps it will flatten out when screwed into the case?

I honestly don't think I'd accept that (especially on a stupidly expensive board). Yes it will flatten out once it's installed on the case, but (IMO) that warping indicates that some of the component pins and/or the board heatsinks aren't evenly installed/soldered.

I'd be concerned that once you tighten it down in the case, the solder traces that aren't resting naturally in the "flattened" state will develop cold joints and/or outright separate from the board over time.

Not sure if I explained that well, but needless to say it's not an ideal situation.
It is definitely appears slightly warped, but I am not sure it is anywhere near as bad as it appears at a glance. The IO shield/bracket/plate (whatever you choose to call it) is holding the right side of the board up in that photo.

Could you take another picture with the IO shield off the side of the box?
 

Xeven

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Joined
Aug 20, 2010
Messages
669
Location
Vancouver, BC
I honestly don't think I'd accept that (especially on a stupidly expensive board). Yes it will flatten out once it's installed on the case, but (IMO) that warping indicates that some of the component pins and/or the board heatsinks aren't evenly installed/soldered.

I'd be concerned that once you tighten it down in the case, the solder traces that aren't resting naturally in the "flattened" state will develop cold joints and/or outright separate from the board over time.

Not sure if I explained that well, but needless to say it's not an ideal situation.
Honestly, the only reason I'm thinking of keeping it is that I got it from newegg.com through a forwarder. Returning it is such a PITA. Newegg.ca and I would have shipped it back the same day. 😬
 

Xeven

Well-known member
Joined
Aug 20, 2010
Messages
669
Location
Vancouver, BC
It is definitely appears slightly warped, but I am not sure it is anywhere near as bad as it appears at a glance. The IO shield/bracket/plate (whatever you choose to call it) is holding the right side of the board up in that photo.

Could you take another picture with the IO shield off the side of the box?
I just mounted it on a testbench do I can't take a good photo from that side atm. I'll take another photo once I take it off.
 

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