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ASUS Z97-A LGA1150 Motherboard Review Comment Thread

xentr_thread_starter
Don't expect any large evolutions. There will be a lot of incremental steps but nothing that will cause a leap forward.

We're literally in a 2-year cycle now where you can buy hardware now and wait two years until there will be enough of a performance uplift to justify upgrading again.

Regarding the Haswell Refresh, it is mostly targeted towards system integrators rather than the boxed processor market.
 
Personally speaking, the only cool thing is that Intel listened and figured out (hopefully) how to better put TIM between the die and IHS. Beyond that...I don't see a valid reason to go to Z97 at this point..

-ST
 
Were there technical reasons for switching from fluxless solder to TIM to begin with? Or purely financial?
 
Hey,

Any update on "However, we did have the occasional "Power Surge On Hub Port" error present itself while running Prime 95, but we suspect that it might be due to a misbehaving USB device on our end or just a bad manually-set BIOS setting. We will update this if needed."?

Picked up the mobo myself and have the same problem. The error occurs all the time under heavy load and actually disconnects/reconnects my USB stuff :s
 
xentr_thread_starter
ASUS just published a new BIOS for the board. Try that.
 
negis said:
Hey,

Any update on "However, we did have the occasional "Power Surge On Hub Port" error present itself while running Prime 95, but we suspect that it might be due to a misbehaving USB device on our end or just a bad manually-set BIOS setting. We will update this if needed."?

Picked up the mobo myself and have the same problem. The error occurs all the time under heavy load and actually disconnects/reconnects my USB stuff :s
Click to expand...


Can you list all USB devices plugged into the board and which ports they are in please?

Need to pass to HQ for replication.
 
Vittra said:
Were there technical reasons for switching from fluxless solder to TIM to begin with? Or purely financial?
Click to expand...

I'd like to know that as well.

I will probably replace the thermal paste inside my 3770K once the warranty is over but so far it can still max overclock around 5.2 but i run it at 4.5 to keep it cool and extremely stable
 
xSS4x said:
I'd like to know that as well.

I will probably replace the thermal paste inside my 3770K once the warranty is over but so far it can still max overclock around 5.2 but i run it at 4.5 to keep it cool and extremely stable
Click to expand...

Two fold. First Cost. TIM is faster and cheaper to apply. This means more finished cpus coming off the line (ie removing a bottleneck). This is actually secondary...and more a bonus.

Secondly...the size of the core is getting smaller. This makes it hard to apply solder to it (ie higher defective products being rejected by the QC dept). PLUS we are talking about lead free solder (thanks EU :angry2:) so the chances of whiskers and micro-cracking (heating/cooling cycles) causing problems is larger on these smaller cores (ie higher RMA rates over the warranty period). This is why the 'server' chips are still using solder....but I doubt we will see many - if any - using it for the consumer marketplace in the future.
 
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